Volume 15, Issue 2, June 2015, Pages 452–456
Sanjoy Mallick1, Mohammad Sharear Kabir2, and Ahmed Sharif3
1 Department of Materials and Metallurgical Engineering, Bangladesh University of Engineering and Technology, Dhaka, Bangladesh
2 Dept of Materials and Metallurgical Engineering, Bangladesh University of Engineering and Technology, Dhaka-1000, Bangladesh
3 Department of Materials and Metallurgical Engineering, Bangladesh University of Engineering and Technology (BUET), Dhaka-1000, Bangladesh
Original language: English
Copyright © 2015 ISSR Journals. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
The effects of nickel additions on the change in microstructure of Zn-xNi lead free solder alloys were investigated. The investigation revealed that increasing Ni additions led to the increase in size of intermetallic Zn-Ni particles along with an increase in volume fraction of intermetallic particles. The microstructure also revealed the presence of the prominent delta (δ) phase in all three compositions of the solder alloy i.e. Zn-0.7 mass% Ni, Zn-1.0 mass% Ni and Zn-1.5 mass% Ni respectively. The presence of irregular shaped δ phase particles and conjoined δ phase particles were noticed in alloys with higher Ni content along with δ particles at grain boundaries. The most remarkable change occurred in the size of Zn grains, which decreased in size as Ni additions were increased. This reduction in size can be attributed to pinning effect of Zn grains by intermetallic particles.
Author Keywords: Zn-xNi lead free solder alloys, intermetallic Zn-Ni particles, delta (δ) phase, conjoined δ phase particles, pinning effect.
Sanjoy Mallick1, Mohammad Sharear Kabir2, and Ahmed Sharif3
1 Department of Materials and Metallurgical Engineering, Bangladesh University of Engineering and Technology, Dhaka, Bangladesh
2 Dept of Materials and Metallurgical Engineering, Bangladesh University of Engineering and Technology, Dhaka-1000, Bangladesh
3 Department of Materials and Metallurgical Engineering, Bangladesh University of Engineering and Technology (BUET), Dhaka-1000, Bangladesh
Original language: English
Copyright © 2015 ISSR Journals. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
Abstract
The effects of nickel additions on the change in microstructure of Zn-xNi lead free solder alloys were investigated. The investigation revealed that increasing Ni additions led to the increase in size of intermetallic Zn-Ni particles along with an increase in volume fraction of intermetallic particles. The microstructure also revealed the presence of the prominent delta (δ) phase in all three compositions of the solder alloy i.e. Zn-0.7 mass% Ni, Zn-1.0 mass% Ni and Zn-1.5 mass% Ni respectively. The presence of irregular shaped δ phase particles and conjoined δ phase particles were noticed in alloys with higher Ni content along with δ particles at grain boundaries. The most remarkable change occurred in the size of Zn grains, which decreased in size as Ni additions were increased. This reduction in size can be attributed to pinning effect of Zn grains by intermetallic particles.
Author Keywords: Zn-xNi lead free solder alloys, intermetallic Zn-Ni particles, delta (δ) phase, conjoined δ phase particles, pinning effect.
How to Cite this Article
Sanjoy Mallick, Mohammad Sharear Kabir, and Ahmed Sharif, “Effect of Ni additions on the microstructure of Zn based lead free solder alloys for high temperature applications,” International Journal of Innovation and Scientific Research, vol. 15, no. 2, pp. 452–456, June 2015.
